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GENERAL TOPICS

• Glossary of terms used in electronics
• Using mind-mapping
• Using web resources 
• Local computer certification

DESIGN ISSUES IN ELECTRONICS

• Effect of component choice on board design
• Guide to using graphicode GC-Prevue
• New product introduction tools
• The DfX concept 
• Demonstration of aliasing of a sinusoidal signal
• FIR digital filter applet

ELECTRONICS MATERIALS

Basic principles of materials

• Coefficient of thermal expansion
• Conductors and insulators
• Dielectric properties 
• Elastic, viscous and viscoelastic materials
• Mechanical properties of metals
• Metals basics
• Microstructure of surfaces
• Stress and its effect on metals
• Stress caused by thermal mismatch
• The ?homologous? temperature

Electronic materials and components

• A component review
• Ceramic components
• Ceramics and glasses
• Classes of component
• Die bond materials 
• Electrolytic capacitors
• Film processes for polymers
• Getting the right part
• Inductive components
• Introduction to components
• Other passive components
• Polymer basics
• Polymer materials and properties
• Polymer types
• Semiconductor packages

Printed circuit boards

• Alternative board materials
• Application methods and their influence on solder mask processing
• Basic board materials
• Selecting a board finish
• Conductor finishes: nickel-gold
• Conductor finishes: tin-lead
• Immersion silver
• Immersion tin
• Organic board coatings
• Properties of laminates
• Solder mask design basics
• Track resistance

ELECTRONICS MANUFACTURE

Assembly processes

• Component insertion
• ICT fixtures
• Intrusive reflow
• Panels and de-panelling
• Repair and rework
• Selective machine soldering
• SM component placement 
• Solder paste printing
• The in-circuit test sequence 
• Wave soldering

Common processes

• Dispensing
• Is your board clean?
• Making mouldings
• Photoimaging
• Plating
• Polymer health and safety issues
• Screen and stencil printing
• To clean, or not to clean?
• Underfilling

 ESD control

• Electrostatics explained
• ESD awareness
• ESD control during manufacture
• Modelling ESD waveforms

Semiconductor back-end processes

• Alternatives for die separation
• Bonding to the chip face
• Plastic encapsulation for semiconductors
• Semiconductor assembly practice
• Semiconductor back-grinding
• Semiconductor die bonding
• Semiconductor die separation
• Semiconductor finishing processes

Soldering

• Changes in solderability with time
• Fluxes for soldering
• Holes and voids
• How joints are made
• Intermetallics
• J alloy
• Other solder-related failure causes
• Pad design
• Pin witness
• Practical solder paste issues
• Reflow soldering
• SIR
• Solder materials
• Solder paste basics
• Solder paste characteristics
• Solder skips
• Solderability
• Solderability testing
• Surface flatness
• Surface tension effects
• Surface wettability
• Tombstoning
• Traditional solder materials
• Wave soldering problems

ENVIRONMENTAL ENGINEERING

• An ISO 14001 overview
• Assembly waste
• Board fabrication issues
• Cleaning
• Flame retardancy additives
• Life cycle thinking
• Making green choices
• PCB recycling issues
• Reuse and recycling
• Sustainable development
• The use of energy
• Volatile Organic compounds (VOCs)

Interconnection methods

• Beam leads
• The chip-scale package
• Conductive inserts
• Conductive resin alternatives
• Connecting to PCBs
• Crimping
• Flexible and flex-rigid circuits
• Flip-chips
• Gluing components
• Hermetic encapsulation
• High-density interconnect
• Inert soldering
• Insulation-displacement connectors
• Press-fit connectors
• Tape automated bonding
• Thick film technology
• Wire wrapping
• Wires matter

SIGNAL INTEGRITY & ELECTROMAGNET COMPATIBILITY (EMC)

• The Gradient of an electrostatic field
• Electrostatic divergence
• Electromagnetic Radiation and PCB Design

MANAGEMENT ISSUES

• Benchmarking
• Change management
• Concurrent engineering
• Learning curves
• MRP
• Poka-yoke
• Requirements for an efficient NPI process
• Risk management

MODELLING

• Choosing a model
• Linear and non-linear models
• Pitfalls of modelling
• Representing space and time in a numerical model

PHYSICS FUNDAMENTALS

• Adhesion
• Atoms and bonding
  
• Effects at liquid surfaces
• Viscosity and flow

RELIABILITY ISSUES AND FAILURE MECHANISMS

• Assessing product reliability
• Board failures
• Conductive Anodic Filaments - the CAF mechanism
• Corrosion
• Derating
• Failure through electrical stress
• Electrical protection
• Electromigration
• Estimating time-to-fail
• Failure due to humidity
• Failure in solder joints
• Failure mechanisms in ceramic capacitors
• Failure mechanisms in other components
• Track resistance
• Hermetic package failure
• Humidity protection
• Improving reliability by screening
• Ingress protection
• Failure for mechanical reasons
• Modelling failure rate
• Moisture absorption
• Protecting against mechanical failure
• Simulating the real world in the test house
• The ?real world?
• Tin pest
• Tin whiskers
• Introduction to failure mechanisms - what is a failure?